IC grinding of mobile phone in new field of engraving machine

 Relying on the advantage of close to Shenzhen Electronic Market, after the company's technical design and development, the first quarter of 2014 successfully SIC-330 mini engraving machine into the mobile phone IC grinding market.

                                                                                                                                                                                    
 From the end of 2013, there are Shenzhen Huaqiang north customers asked whether small carved machine can carry out mobile phone IC grinding. As requested by the customer, the company organizes technical personnel to carry out research and design, trial and error. Successfully help customers to design and complete the fixture, the smooth completion of mobile phone IC grinding. With carved machine grinding mobile phone IC, high precision, low repair rate, received many customers favor. In the first quarter alone many customers placed orders for the SIC-330 small engraving machine. Also welcome the vast number of new customers to try the machine proofing. We will be dedicated to different needs of customers to provide the most sincere service. Bobo Bobo